6th International Workshop on

THERMal INvestigations of ICs and Systems


plus
a special half-day on compact models

September 24-27, 2000,
Budapest, Hungary. Logo

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IEEE Computer Society


The Institute of Electrical & Electronics Engineers, Inc.

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IEEE Components, Packaging and Manufacturing Technology Society

Sponsored by the IEEE Computer Society Test Technology Technical Council and TIMA Laboratory in cooperation with the IEEE Components, Packaging, and Manufacturing Technology Society and with the DETERMIN Project supported by the European Commission.


AIM of the WORKSHOP

INFORMATION

LOCATION

TRANSPORTATION

PROCEEDINGS

INFORMAL PROCEEDINGS, GUIDELINES

EXHIBITION

Proceedings Order Form

WORKSHOP COMMITTEE

WORKSHOP at a GLANCE

TUTORIAL

TECHNICAL PROGRAMME

WORKSHOP REGISTRATION FORM

HOTEL INFORMATION

HOTEL RESERVATION

Call for Papers


THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronics microstructures and electronic parts in general. These questions are becoming more and more crucial with the increasing element density of deep submicron downscaling of integrated circuits necessitating thermal simulation, monitoring and cooling. Thermal management is expected to become an increasingly dominating factor of a system's cost. The high element density of MCMs, the growing power dissipated in a package, etc., and the mobile parts of microsystems raise new thermal problems to be solved in the near future necessitating the regular discussion of the experts in these fields. Finally, there is an increasing need for accurate assessment of the boundary conditions used in the analysis of electronic parts, which requires a concurrent solution of the thermal behaviour of the whole system.

The main topics to be discussed during the Workshop are the following:

  • Thermal and Temperature Sensors
  • Measurement of Thermal Properties
  • Thermal Simulation
  • Acquisition and Analysis of Thermal Data
  • Electro-thermal Simulation
  • Temperature Mapping
  • Thermal Modelling and Investigation of Packages
  • Novel and Advanced Cooling Techniques
  • Reliability Issues
  • Thermal Performance of Interconnects
  • High Temperature Electronics
  • Heat Transfer Enhancement
  • Heat Transfer Education
  • Flow Visualisation Techniques
  • Validation of Thermal Software
  • Turbulence Modelling in Complex Geometrics
  • Coupled (thermo-mechanical, thermo- optical, etc.) Effects
  • Thermal Characterization

Previous THERMINIC Workshops have been held in Grenoble (1995), Budapest (1996), Cannes (1997 and 1998) and Rome (1999).
The programme includes invited talks, oral and poster presentations, a panel and a half-day organized by the PROFIT project on compact models. Oral contributions consist of 15 min. presentations followed by 5 min. discussion. The posters will be introduced by one slide in 3 minutes each.

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General Chair: B. Courtois, TIMA Grenoble, France
Vice General Chair: M. Rencz, BUTE, Hungary
Programme Chairs: C. Lasance, Philips, The Netherlands
V. Székely, BUTE, Hungary
Organization Chair: A. Poppe, MicRed, Hungary


D. Estève
M. Baelmans
D. Agonafer
A. Bar-Cohen
W. Claeys
I. Bársony
D. Blackburn
K. Azar
G. De Mey
E. Suhir
E. Jones
Y. Zorian
P. Tuerkes
A. Tay
U. Dillner
J.M. Dorkel
A. Rubio
B. Siegal
J. Parry
M. Kimura
S. Roumenin
J. Rantala
Y. Joshi
N. Sabry
J.B. Saulnier
H. Pape
O. Slattery
A. Napieralski
M. Glesner
D. De Cogan
H. Jaouen
P. Raad
K. Chakrabarty
S. Levitan
A. Ortega
LAAS/France
KUL/Belgium
IBM Corp./USA
U. of Minnesota/USA
U. Bordeaux/France
KFKI-ATKI/ Hungary
NIST Gaithersburg/USA
Lucent Techno./USA
U. Gent/Belgium
Bell Laboratories/USA
US Air Force/USA
LogicVision/USA
Siemens/Germany
NU Singapore/Singapore
IPHT/Germany
LAAS/France
UPC/Spain
Thermal Eng. Ass./USA
Flomerics/UK
U. Tohoku/Japan
Bulgarian Acad. Sc./Bulgaria
Nokia/Finland
U. of Maryland/USA
U. Mansoura/Egypt
ENSMA/France
Infineon Techno./Germany
NMRC/Ireland
TU Lédz/Poland
TH Darmstadt/Germany
U. of East Anglia
STMicroelectronics/France
Southern Methodist U./USA
Duke U./USA
U. of Pittsburgh/USA
U. Arizona/USA

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More information on the Workshop is available from:

Bernard   COURTOIS

TIMA
46 Avenue Félix Viallet
38031 Grenoble cedex
France
Tel.: +33 4 76 57 46 15
Fax: +33 4 76 47 38 14

Marta   RENCZ

Budapest University of Technology & Economics (BUTE)
Dept of Electron Devices
Goldmann György tér 3
H-1114 Budapest XI, Hungary
Tel.: +36 1 463 2702
Fax: +36 1 463 2973

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The Workshop will be held at Hotel Mercure Buda in Budapest. Hotel Mercure Buda is next to Deli pu. Railway station, at the west side of the Castle Hill in Buda. Public transport: metro M2, tram #18, 61. 5 min. walking from the Castle District, 5 min. by metro from the city of Pest.

Budapest is the capital of Hungary. Budapest, often referred as the "Queen of the Danube" is a large cosmopolitan city with abundance of culture, history and entertainment to offer visitors. It boasts world-class opera, ballet, jazz night-clubs, musical theatre, numerous museums both large and small, multitude of hot springs that are the source of its famous baths, restaurants with Hungarian and international cuisine and much more.

Hotel Mercure Buda
Tel.: +36 1 488 8176
Fax: +36 1 488 8178
E-mail: mercurebuda@pannoiniahotels.hu
Address: H-1013 Budapest, Krisztina krt. 41-43

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How to reach Budapest ?
Budapest can be accessed by air, by rail and by car.

  • Air information:
    National airline: MALEV
    International Airport: Budapest-Ferihegy 2
    MALEV in cooperation with Delta runs a daily link to the USA.
    MALEV and its partner airlines use terminal 2A while all other airlines use terminal 2B.
    Airport Minibus is preferred to taxis. Single fare costs HUF 1500. Booking at Ferihegy 2 terminals is possible immediately upon arrival at the customs exit.

  • Rail information: There are 3 principal railway stations in Budapest (Nyugati P.u., Keleti P.u., Deli P.u.) which are the terminating points of major international railway connections from Eastern and Western Europe. There are daily Euro City connections to Budapest.

  • Road information: Budapest is the focal point of the Hungarian motorways and major roads. There is direct motorway link to Western-Europe (motorway M1). All the motorways (M1 to the West, M3 to the East, M5 to the South-east, M7 to the South-west) are free except a portion of M1 between the Austrian border and the city of György.

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Blocks of rooms have been reserved in two hotels, including Hotel Mercure Buda where the Workshop will be held. Rooms are reserved from the 23 September. September is a high season in BUDAPEST so early reservation is recommended (before 24 August 2000). Reservations will be on a first-come first-served basis. Blocks of rooms for THERMINIC 2000 attendees have been reserved at the following hotels:
Hotel Mercure Buda
Single room: DEM 150/night (HUF 20000 or EUR 78 )
Double/twin room: DEM 170/night (HUF 230 00 or EUR 90 )
Breakfast, tax included
Keyword: THERMINIC
Payment: cash or major credit cards
Deposit: 1 night
Reservation deadline: 24.08.2000
Tel.: +36 1 488 8176
Fax: +36 1 488 8178
E-mail: mercurebuda@pannoiniahotels.hu
Address: H-1013 Budapest, Krisztina krt. 41-43
Hotel Ventura
10 single/double rooms have been reserved
Single room: DEM 60/night (HUF 8000 or EUR 31)
Double/twin room: DEM 76/night (HUF 10000 or EUR 39)
Breakfast, tax included
Keyword: THERMINIC
Payment: cash or major credit cards
Deposit: 1 night
Reservation deadline: 24.08.2000
Tel.: +36 1 208 1232
Fax: +36 1 208 1234
E-mail: ventura@eravishotels.hu
Address: H-1119 Budapest, Fehérvàri út 179
Public transport: tram #18; about 20 min. from Hotel Mercure Buda by tram.

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Proceedings, Special issue of the Microelectronics Journal, Special section of the IEEE Transactions on Components and Packaging Technologies and Special section of the Transactions of the ASME, Journal of Electronic Packaging.

  • The Special issue of Microelectronics Journal collect papers dealing with thermal simulation, measuring and monitoring of thermal states. The submissions (not limited to those, presented at the Workshop) should be approximately 4,000 words, but longer or shorter contributions may be accepted. Detailed specifications for the submissions may be found in any issue of the Journal (back cover).
  • The Special section of the IEEE Transactions on Components and Packaging Technologies will focus on thermal aspects relating to packaging. The submissions (not limited to those, presented at the Workshop) should be typewritten or printed double-spaced, one side only, using a font size of 11 points or larger, and include an informative 100-250 word abstract. Detailed specifications for the submissions may be found in any issue of the Journal (back cover).
  • The Special section of the Transactions of the ASME, Journal of Electronic Packaging, will focus on thermal and mechanical aspects related to packaging. The submissions (not limited to those, presented at the Workshop) should be typed double-spaced, on one side of the page, using 22x28 mm (8 x 11 inch) using a 10pt. type minimum. Detailed specifications for the submissions may be found in any issue of the Journal.

The deadline to submit to either of the Special Issues is 31 October 2000. Authors should indicate the Journal they submit to. They will be notified about their papers by 31 December 2000. Final versions will be due by 31 January 2001, along the instructions that will be provided in due time.
Submit 6 copies (specifying the Journal you submit to):
Bernard COURTOIS
TIMA
46 Avenue Felix Viallet
38031 Grenoble cedex, France
Tel: +33 4 76 57 46 15
Fax: +33 4 76 47 38 14


Companies that would like to exhibit should contact the General Chair.

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Copyright © 2000 Laboratoire TIMA.
Tous droits réservés.