|11th International Workshop on|
|THERMAL INVESTIGATIONS of ICs and Systems|
| 27 - 30 September 2005, |
Lake Maggiore, Italy.
|IEEE Computer Society
Test Technology Technical Council
|In cooperation with|
Thermal Management Committe of IEEE CMPT
General Information and Programme |
|Updated on November 3, 2005.|
Aim of the Workshop
THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronic microstructures and electronic parts in general. These questions are becoming more and more crucial with the increasing element density of circuits packaged together and with the move to nanotechnology. These trends are calling for thermal simulation, monitoring and cooling. Thermal management is expected to become an increasingly dominating factor of a system's cost. The growing power dissipated in a package, the mobile parts of microsystems raise new thermal problems to be solved in the near future necessitating the regular discussion of the experts in these fields. Finally, there is an increasing need for accurate assessment of the boundary conditions used in the analysis of electronic parts, which requires a concurrent solution of the thermal behaviour of the whole system.
The main topics to be discussed during the Workshop are the following:
The programme includes 2 invited talks, 33 oral and 18 poster presentations and 3 Special sessions. Oral contributions consist of 15 min. presentations followed by 5 min. discussion. The posters will be introduced by one slide in maximum 3 minutes each.
Special issues and special sections
Special issues and special sections of leading periodicals have been organised regarding the previous Workshops (Journal of Sensors and Actuators, Microelectronics Journal, IEEE Transactions on VLSI Systems, IEEE Transactions on Components and Packaging Technologies, Journal of Electronic Packaging). It is again expected to have special issues and special sections of leading periodicals as follow up of the Workshop 2005.
More information on the Workshop is available from:
The Workshop will take place in the Best Western Hotel Villa Carlotta, in Belgirate in Italy. The Best Western Hotel Villa Carlotta is located between a charming private park of 40,000 square metres and the Lake Maggiore.
Airplane : The recent International Airport of Malpensa is situated at 35 km, with daily flies from and to all sides in the world. You can fly also to Milan Linate, the other airport of Milan, near the city but farther from the Lake.
Malpensa information, tel. +39 02.74852200
Malpensa news for the travellers, tel. +39 02.26800613
Timetable and Fares of Shuttles:
Reservation: The Best Western Hotel Villa Carlotta will arrange transfer, reservation by the THERMINIC reservation form.
• Fare: Malpensa – Verbania – Belgirate, around 10.50 Euros.Transfer by car: Fare 85 Euros (maxi 3 persons).
• Company name: Alibus.
• This shuttle service has to be ordered the day before the transfer till 10 a.m., after this time the service is not guaranteed.
Transfer by minibus: Fare 97 Euros (maxi 8 persons). For this transfer The Best Western Hotel Villa Carlotta needs: first name, last name, flight Nr. Scheduled Time two days before.
Train : The FS, Ferrovie dello Stato, is the official name of national railways in Italy. It is easy to reach the Maggiore Lake from Milan or foreign countries.
Car : Easy access from everywhere in Europe. The Maggiore Lake is near Switzerland, therefore easy to reach from Germany and France.
From Milan: Motorway A8 Milano-Laghi. First choose Varese and reject Como. Then, in Gallarate, reject Varese (and the A8) and follow A26 to Gravellona Toce; exit in Vergiate-Sesto Calende or Arona, Gravellona Toce, Verbania; the SS 33 (State road) "Sempione" follows the Piedmont lakeshore from Castelletto Ticino to the Switzerland.
From Genova: Motorway A26 Genova-Gravellona Toce, via Alessandria and Vercelli-Novara; go forward and exit in Castelletto Ticino, Arona, Gravellona Toce or Verbania.
From Switzerland: Swiss Motorway N2 from Basel to Lugano, through the Gotthard tunnel. Exit in South-Bellinzona and follow to Lago Maggiore, Locarno and Ascona, or to the Lombard Italian frontier to Maccagno and Luino. You can also exit in Ponte Tresa (nearby Lugano and the Lugano Airport), then follow to Luino or Laveno or Varese.
Social Event on 29 September 2005
An exhibition will be held during the time of the Workshop. Tabletops or Spaces for a portable marketing stand 6sqm are available to companies interested to exhibit equipment, materials, software, etc... Booking of each table-top or Spaces for a portable marketing stand 6sqm will give one slot of time during the vendors' session. The number of space is limited. They will be offered on a first signed - first served basis. Contact the General Chair for more information.
Specific Events Sponsoring
If you wish to sponsor an event like a reception, a lunch, or any specific event during the Workshop, please contact the General Chair.
All posters will be introduced by one slide in 3 minutes each. They will be presented in 2 sessions on Wednesday September 28. Poster introductions session I from 12:40 to 13:10 and Poster introductions session II from 17:20 to 17:50.
They will be mounted during the registration or the first break time. Authors are expected to be at their posters during the posters viewing sessions on Wednesday September 28 from 18:20 to 20:00 and Thursday September 29 from 15:40 to 16:40. The posters will be removed by the end of the Workshop.
ARE THERMAL PROBLEMS WITH CHIPS SOLVED WITH ARCHITECTURAL ASPECTS ?
T. Nakamura, University of Tohoku, Japan.
It is productive to think of how thermal problems on chips are dealt with in designing COOL Chips with low-power and high-speed. In terms of architectural aspects, the problems are somehow solved. We could save energy on chip computing, using high efficient chip technologies in hardware and software.
CARBON NANOTUBES AS THERMAL SENSING ELEMENTS
W.J. Li, The Chinese University of Hong Kong.
A technology to rapidly construct Carbon Nanotubes (CNTs) based sensing elements will first be presented. Then, experimental results in using CNTs as extremely low power consuming and ultra fast response thermal sensors will be shown.
MICRO TO NANO SCALE THERMAL MEASUREMENTS ON ICS: BENCHMARKING THE UP-TO-DATE METROLOGIES
Organized by Research Network 'Micro and Nanoscale Heat Transfer' of the CNRS (The French National Center for Scientific Research).
THERMAL STRESS AND THERMAL STRESS FAILURES: PREDICTION AND PREVENTION (2 parts)
Organized by E. Suhir, University of California, Santa Cruz, USA.
While the Workshop organisation makes every effort in order to ensure the safety and well being of all the Workshop participants and associates, the Workshop cannot take responsibility for any accident or damage that may occur during the Workshop.