11th International Workshop on
THERMAL INVESTIGATIONS of ICs and Systems

Program Schedule

Wednesday September 28, 2005

08:0009:30 Registration
09:3009:40 Welcome Address
Chair: B. Courtois, TIMA Labs, Grenoble, France
09:40-10:20 Invited Talk I: ARE THERMAL PROBLEMS WITH CHIPS SOLVED WITH ARCHITECTURAL ASPECTS ?
T. Nakamura, U. of Tohoku, Japan
Chair: C. Lasance, Philips Research Laboratories, Eindhoven, The Netherlands
10:20-12:20 Session 1: TEMPERATURE AWARE DESIGN
Chair: A. Rubio, UPC, Barcelona, Spain
   10:20  THERMAL-AWARE DESIGN RULES FOR NANOMETER ICS
J-L. Rosselló, S.Bota, M. Rosales, J. Segura, U. de Les Illes Balears, Palma de Mallorca, Spain
A. Keshavarzi, Microprocessor Research Labs, Intel, USA
   10:40  A BLOCK-LEVEL OPTIMIZATION OF COMPREHENSIVE THERMAL-AWARE POWER MANAGEMENT FOR SOC INTEGRATION IN NANO-SCALE CMOS TECHNOLOGY
W-M. Chan, H. Chiueh, National Chiao Tung U., Taiwan
   11:00  TRANSIENT THERMAL SIMULATION OF A POWER HYBRID MODULE USING AN ANALYTICAL SOLUTION OF THE HEAT EQUATION
M. Janicki, A. Napieralski, TU. of Lodz, Poland
G. De Mey, Ghent U., Belgium
   11:20  TWO-DIMENSIONAL TEMPERATURE FIELDS IN ASICS FOR MULTIPLE HEAT SOURCES OF ARBITRARY POWER DISSIPATION DERIVED FROM CONFORMAL MAPPING THEORY
A. Augustin, A. Kostka, Darmstadt U. of Technology, Germany
B. Maj, Continental Teves AG, Frankfurt, Germany
   11:40  A NOVEL APPROACH FOR GENERATING DYNAMIC COMPACT MODELS OF THERMAL NETWORKS HAVING LARGE NUMBERS OF POWER SOURCES
L. Codecasa, D. D'Amore, P. Maffezzoni, N. Spennagallo, Politecnico di Milano, Italy
   12:00  FLEXIBLE PROFILE COMPACT THERMAL MODELS
M-N. Sabry, U. Française d'Egypte, Cairo, Egypt
12:20     COFFEE BREAK
12:40-13:10 Poster Introductions session I
Chair: M. Rencz, BUTE, Budapest, Hungary
   12:40  SUPERIOR-ORDER IMPROVED PERFORMANCES CURVATURE-CORRECTED VOLTAGE REFERENCE USING A TEMPERATURE-DEPENDENT CURRENT GENERATOR CIRCUIT
P. Cosmin, Faculty of Electronics, Telecommunications and Information Technology, Bucharest, Romania
   12:43  LOGARITHMIC CURVATURE-CORRECTED WEAK INVERSION CMOS VOLTAGE REFERENCE WITH IMPROVED PERFORMANCE
P. Cosmin, Faculty of Electronics, Telecommunications and Information Technology, Bucharest, Romania
   12:46  RELIABILITY STUDY OF POWER RF LDMOS DEVICES UNDER THERMAL STRESS
M.A. Belaid, LEMI, Rouen, France
   12:49  AN ADAPTIVE-GRAIN THERMAL SIMULATION METHOD TO EVALUATE EFFECTS OF SPATIO-TEMPORAL ANALYSIS GRANULARITY UPON THE THERMAL BEHAVIOR OF VLSIS
M. Ito, Tohoku U., Japan
   12:52  THE SISSY ELECTRO-THERMAL SIMULATION SYSTEM BASED ON MODERN SOFTWARE TECHNOLOGIES
G. Horváth, A. Poppe, BUTE, Budapest, Hungary
   12:55  THEORETICAL INVESTIGATION OF THERMAL FEEDBACK EFFECT IN LOW-POWER CIRCUITS
M. Kuuse, National Semiconductor Estonia, Tallinn, Estonia
M. Loikkanen, Oulu U., Finland
G. Bognár, BUTE, Budapest, Hungary
   12:58  AN APPROACH TO THE ELECTRICAL CHARACTERIZATION OF ANALOG BLOCKS THROUGH THERMAL MEASUREMENTS
D. Mateo, J. Altet, E. Aldrete, UPC, Barcelona, Spain
   13:01  A NEW METHOD OF THE THERMAL RESISTANCE MEASUREMENTS
J. Zarebski, K. Gorecki, Gdynia Maritime U., Poland
   13:04  THERMAL ANALYSIS OF MULTI-FINGER AlGaN/GaN HEMTS: COMPARISON BETWEEN FLIP-CHIP AND SUBSTRATE REMOVAL
H. Oprins, J. Das, R. Vandersmissen, B. Vandevelde, M. Germain, IMEC, Leuven, Belgium
13:10 LUNCH
14:40-16:00 THERMAL STRESS AND THERMAL STRESS FAILURES: PREDICTION AND PREVENTION
Special session organized by E. Suhir, U. of California, Santa Cruz, USA (invited)
Part I: PREDICTIVE MODELING
Chair: A-C. Pliska, CSEM, Zurich, Switzerland
   14:40  BONDING SEMICONDUCTOR LASER CHIPS: SUBSTRATE MATERIAL FIGURE-OF-MERIT AND DIE ATTACH LAYER INFLUENCE
A-C. Pliska, CSEM, Zurich, Switzerland
   15:00  THERMAL AND THERMO-MECHANICAL MODELING OF POLYMER OVERMOLDED ELECTRONICS
F. Sarvar, N.J. Teh, D.C. Whalley, D.A. Hutt, P.J. Palmer, Loughborough U., Leics, UK
   15:20  ANALYTICAL THERMAL STRESS MODELING IN PHYSICAL-DESIGN-FOR-RELIABILITY OF MICRO- AND OPTO-ELECTRONIC SYSTEMS
E. Suhir, U. of California, Santa Cruz, USA
   15:40  TRYING TO MINIMIZE THE BONDLINE THERMAL RESISTANCE IN THERMAL INTERFACE MATERIALS WITHOUT EFFECTING RELIABILITY
J.A. Emerson, M.J. Rightley, J.A. Galloway, D.F. Rae, Sandia National laboratories, Albuquerque, USA
N.M. and D.L. Huber, E.J. Cotts, Binghamton U., Binghamton, USA
16:00     COFFEE BREAK
16:20-17:20 Session 2: SENSORS
Chair: P. Raad, Southern Methodist U., Dallas, USA
   16:20  MICROMACHINED HEAT EXCHANGER FOR A CRYOSURGICAL PROBE
W. Zhu, Y. Gianchandani, U. of Michigan, Ann Arbor, USA
G. Nellis, S. Klein, U. of Wisconsin-Madison, USA
   16:40  PROPOSAL OF A NEW STRUCTURE THERMAL VACUUM SENSOR WITH DIODE-THERMISTORS COMBINED WITH A MICRO-AIR-BRIDGE HEATER
M. Kimura, Tohoku-Gakuin U., Japan
   17:00  DIFFERENTIAL TEMPERATURE SENSORS IN 0.35m CMOS TECHNOLOGY
E. Aldrete, D. Mateo, J. Altet, UPC, Barcelona, Spain
17:20-17:50 Poster Introductions session II
Chair: M. Rencz, BUTE, Budapest, Hungary
   17:20  IMPROVED 3D-NONLINEAR COMPACT MODELING FOR MULTI CHIPS SYSTEMS
W. Habra, P. Tounsi, J-M. Dorkel, LAAS-CNRS, Toulouse, France
   17:23  MODEL REDUCTION FOR THERMO-MECHANICAL SIMULATION OF PACKAGES
J. Wilde, E. Rudnyi, J. Korvink, E. Zukowski, U. of Freiburg, IMTEK, Germany
   17:26  ERROR INDICATOR TO AUTOMATICALLY GENERATE DYNAMIC COMPACT PARAMETRIC THERMAL MODELS
E. Rudnyi, G. Korvink, U. of Freiburg, IMTEK, Germany
L. Feng, Fudan U., China
M. Salleras, S. Marco, U. de Barcelona, Spain
   17:29  INVERSE THERMAL PROBLEM VIA MODEL ORDER REDUCTION
T. Bechtold, U. of Freiburg, IMTEK, Germany
   17:32  TEMPERATURE GRADIENT ALLEVIATING METHOD FOR ARITHMETIC UNITS
R. Egawa, GSIS Tohoku U., Japan
   17:35  THERMAL MODELING OF POWER HYBRID MODULES
M. Ayadi, ENIS, Sfax, Tunisia
   17:38  VALIDATION OF THE DJOSER ANALYTICAL THERMAL SIMULATOR FOR ELECTRONIC POWER DEVICES AND ASSEMBLING STRUCTURES
P-E. Bagnoli, F. Stefani, C. Bartoli, U. of Pisa, Italy
M. Monichino, Hybritech, Milano, Italy
   17:41  ELECTRO-THERMAL-MECHANICAL ANALYSIS OF A HIQUAD PACKAGE FOR HIGH CURRENT AND HIGH POWER APPLICATION
L. Chen, H. Oprins, B. Vandevelde, IMEC Leuven, Belgium
G. Brizar, D. Vanderstraeten, E. Blansaer, AMI Semiconductor Oudenaarde, Belgium
17:5018:20 Vendors session
Chair: B. Courtois, TIMA Labs, Grenoble, France
18:20-20:00 Exhibition and Poster Viewing
19:00-20:00 COCKTAIL

Thursday September 29

08:30-10:10 THERMAL STRESS AND THERMAL STRESS FAILURES: PREDICTION AND PREVENTION
Special session organized by E. Suhir, U. of California, Santa Cruz, USA (invited)
Part II: THERMO-MECHANICAL BEHAVIOR AND RELIABILITY OF MATERIALS AND INTERFACES
Chair: A. Shakouri, U. of California, Santa Cruz, USA
   8:30  ACOUSTIC CHARACTERIZATION OF INTERFACES
A. Shakouri, U. of California, Santa Cruz, USA
   8:50  EFFECT OF TEMPERATURE ON VIBRATIONS IN PHYSICALLY NONLINEAR PIEZOELECTRIC RODS
V. Birman, U. of Missouri, Rolla, USA
E. Suhir, U. of California, Santa Cruz, USA
   9:10  ACCELERATED FAILURE TEST FOR HIGH-T APPLICATIONS OF POWER MOSFET BY POWER CYCLING
R. Schacht, B. Michel, Fraunhofer Institute, Berlin, Germany
   9:30  EFFECT OF ASSEMBLY STIFFNESS AND SOLDER PROPERTIES ON THERMAL CYCLING ACCELERATION FACTORS
R. Darveaux, Amkor Technologies, Chandler, USA
   9:50  THERMAL FATIGUE ASSESSMENT OF LEAD-FREE SOLDER JOINTS
Q. Yu, Yokohama National U., Japan
10:10     COFFEE BREAK
10:30-12:10 Session 3: THERMAL AND TEMPERATURE MEASUREMENT METHODS
Chair: W. Claeys, U. Bordeaux 1, France
   10:30  SMOKE AND CFD VISUALIZATION OF THE FLOW AFTER AN EMC SCREEN IN A SUBRACK MODEL
R. Antón, H. Jonsson, Royal Institute of Technology, Stockholm, Sweden
M. Castiella, Tecnun U. of Navarra, Spain
B. Moshfegh, U. og Gävle, Sweden
   10:50  A SCANNING FLUORESCENT PROBE FOR LOCAL TEMPERATURE IMAGING OF MICROELECTRONIC CIRCUITS
L. Aigouy, G. Tessier, Y. De Wilde, ESPCI, Paris, France
M. Mortier, ENSCP, Paris, France
B. Charlot, TIMA Labs, Grenoble, France
   11:10  THERMAL IMAGING OF Si, GaAs AND GaN -BASED DEVICES WITHIN THE MICROTHERM PROJECT
S. Pavageau, G. Tessier, ESPCI, Paris, France
   11:30  DETERMINATION OF THERMOPHYSICAL PROPERTIES OF Si/SiGe SUPERLATTICES WITH A PUMP-PROBE TECHNIQUE
Y. Ezzahri, S. Grauby, S. Dilhaire, J-M. Rampnoux, W. Claeys, U. Bordeaux 1, France
   11:50  AN INTEGRATED EXPERIMENTAL AND COMPUTATIONAL SYSTEM FOR THE THERMAL CHARACTERIZATION OF COMPLEX THREE-DIMENSIONAL SUBMICRON ELECTRONIC DEVICES
P. Raad, P. Komarov, M. Burzo, Southern Methodist U., Dallas, USA
12:30 LUNCH
14:00-15:20 Session 4: THERMAL TRANSIENT TESTING
Chair: J. Janssen, Philips Semiconductors, The Netherlands
   14:00  TRANSIENT THERMAL ANALYSIS OF POWER LEDS AT PACKAGE & BOARD LEVEL
J.H. Yu, Lumileds Lighting, Best, The Netherlands
G. Farkas, MicReD, Budapest, Hungary
   14:20  MECHANISM AND THERMAL EFFECT OF DELAMINATION IN LIGHT-EMITTING DIODE PACKAGES
M-W. Shin, J. Hu, L. Yang, Myong Ji U., Yongin, Korea
   14:40  STRUCTURE FUNCTION REPRESENTATION OF MULTI-DIRECTIONAL HEAT-FLOWS
L. Codecasa, D. D'Amore, P. Maffezzoni, Politecnico di Milano, Italy
   15:00  CROSS-VERIFICATION OF THERMAL CHARACTERISATION OF A MICRO-COOLER
Z. Kohári, G. Bognár, G. Horváth, E. Kollár, A. Poppe, M. Rencz, V. Székely, BUTE, Budapest, Hungary
15:20     COFFEE BREAK
15:40-16:40 Exhibition and Poster Viewing
16:40 Enf of sessions
17:00   Departure from the Hotel Villa Carlotta, by a private boat to the palace and the gardens of Isola Bella, the most important attraction of Lake Maggiore.
20:00   Typical dinner at the Hotel Milano. The restaurant has the largest and most charming terrace overlooking the most beautiful Italian lake. (Walking distance to and from the hotel Villa Carlotta)

Friday September 30

09:00-09:40 Invited Talk II: CARBON NANOTUBES AS THERMAL SENSING ELEMENTS
W.J. Li, The Chinese University of Hong Kong
Chair: V. Székely, BUTE, Budapest, Hungary
09:40-10:40 Session 5: HEAT TRANSFER AND COOLING
Chair: L. Codecasa, Politecnico di Milano, Italy
   09:40  RAREFIED GAS HEAT TRANSFER BETWEEN A NANOMETRIC TIP AND A SAMPLE
P-O. Chapuis, EM2C-Ecole Centrale Paris, France
   10:00  THERMIONIC REFRIGERATOR WITH NONPLANAR ELECTRODES AND COMBINED FIELD AND THERMIONIC ELECTRON EMISSION
Y-Ch. Gerstenmaier, Siemens AG, Munich, Germany
G. Wachutka, Munich U. of Technology, Germany
   10:20  DROPLET-BASED HOT SPOT COOLING USING TOPLESS DIGITAL MICROFLUIDICS ON A PRINTED CIRCUIT BOARD
Ph. Paik, V. Pamula, K. Chakrabarty, Duke U., USA
10:40     COFFEE BREAK
11:00-12:40 MICRO TO NANO SCALE THERMAL MEASUREMENTS ON ICS: BENCHMARKING THE UP-TO-DATE METROLOGIES
Special session organized by the Research Network "Micro and Nanoscale Heat Transfer" of the CNRS (The French National Center for Scientific Research)
Chair: S. Volz, Ecole Centrale Paris, Châtenay-Malabry, France
   11:00  INTRODUCTION
S. Volz, Ecole Centrale Paris, Châtenay-Malabry, France
   11:20  TEMPERATURE VARIATIONS IMAGING BY THERMOREFLECTANCE AND STHM TECHNIQUES
S. Grauby, A. Salhi, L. Patino Lopez, S. Dilhaire, W. Claeys, U. Bordeaux 1, France
   11:35  QUANTITATIVE THERMOREFLECTANCE IMAGING: CALIBRATION METHOD AND VALIDATION ON A DEDICATED INTEGRATED CIRCUIT
G. Tessier, ESPCI, Paris, France
   11:50  ULTRA-LOCAL TEMPERATURE MAPPING WITH AN INTRINSIC THERMOCOUPLE
S. Volz, Ecole Centrale Paris, Châtenay-Malabry, France
   12:05  TEMPERATURE MEASUREMENT OF MICROSYSTEMS BY SCANNING THERMAL MICROSCOPY
N. Trannoy, U. de Reims, France
   12:20  DISCUSSION
12:40 LUNCH
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