therminic 2026
Berlin-koepenick | September 16 - 18, 2026
International Workshop on
Thermal Investigations of ICs and Systems
The 32nd THERMINIC Workshop will be held in Berlin-Koepenick, Germany. THERMINIC is the major European Workshop related to thermal and reliability issues in electronic components and systems. For academics and industrialists involved in micro and power electronics this annual event promises to be a very special occasion with a high quality technical program and exciting social events.
Authors are invited to submit an abstract describing recent work. Abstracts must detail the objectives of the work presented and demonstrate new results. All abstracts will be single-blind reviewed. There will be best paper and best poster awards. Abstracts should be related, but not limited to, the following topics:
- Thermal Phenomena in Simulation & Experiment
- Electronics Cooling Concepts & Applications
- Thermo-Mechanical Reliability
Below you can see a detailed list of topics.
The technical programme will include oral talks, poster presentations and invited keynote talks given by renowned speakers. We will again offer a short course on the day before the workshop.
Venue
NYX Hotel Berlin-Köpenick
Grünauer Str. 1
12557 Berlin
Germany
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Download Call for Papers
AREAS OF INTEREST
include, but are not limited to, the following topics:
Thermal Phenomena in Simulation & Experiment:
- Thermal management of electronic components and systems
- Classical and modern thermometry and thermography
- Thermal interface materials and their characterisation
- Thermal modelling and investigation of packages
- Nano-scale heat transfer
- Multi-physics simulation and field coupling
- Electro-thermal modelling and simulation
- CFD modelling and benchmarking
- Advanced thermal materials and technologies
- Numerical methods for multi-scale heat transfer
- Advanced mathematics and statistical concepts / AI methods for digital twins
Electronics Cooling Concepts & Applications:
- Cooling concepts: air, liquid, 2-phase, etc.
- Power electronics cooling technologies
- HPC & Chiplet cooling
- Power electronics & HPC cooling
- High temperature electronics
- Solid state lighting & LED packages
- Thermo-electric and sub-ambient cooling
- Novel and advanced thermal technologies
- Heat pipe and vapor chambers
- 3D heterogeneous integration and cooling
- Ultra low form factor air cooling
- Novel manufacturing methods
- Cooling for IoT, CPS, mobile, edge computing
- Thermal buffering for computational sprinting
- Thermal management for quantum technologies & cryo-applications
- Battery thermal management
Thermo-Mechanical Reliability
- Thermo-mechanical reliability
- Prognostics and health monitoring
- Lifetime modelling and prediction
- Damage and fracture mechanics
- Failure analysis and inline inspection
- Thermal and Temperature Sensors
- Acquisition and analysis of Thermal data
- Thermal Simulation
- Temperature Mapping
- Electro-thermal Simulation
- Novel and Advanced Cooling Techniques
- Thermal Modelling & Investigation of Packages
- Thermal Performance of Interconnects
- Reliability Issues
- Heat Transfer Enhancement
- High Temperature Electronics
- Validation of Thermal Software
- Heat Transfer Education
- Coupled (Thermo-mechanical, Thermo-optical, etc.) Effects
- Flow Visualisation Techniques
- Turbulence Modelling in Complex Geometrics
- Thermal Stress: Theory and Experiment
- Defect and failure modelling
- Thermal Stress Failures: Prediction and Prevention
- Reliability evolution and prediction
- Multiphysics simulation
- Nanotechnology Applications
- Nanoengineering issues
- Noise control
- Education
- 3DIC, power electronics
- Measurement of Thermal Properties