International Workshop on
Thermal Investigations of ICs and Systems
The 33rd THERMINIC Workshop will be held in Graz, Austria. THERMINIC is the major European Workshop related to thermal and reliability issues in electronic components and systems. For academics and industrialists involved in micro and power electronics this annual event promises to be a very special occasion with a high quality technical program and exciting social events.
Authors are invited to submit an abstract describing recent work. Abstracts must detail the objectives of the work presented and demonstrate new results. All abstracts will be double-blind reviewed and submitted papers are subjected to a plagiarism check. There will be best paper and best poster awards. Abstracts should be related, but not limited to, the following topics:
- Thermal Phenomena in Simulation & Experiment
- Electronics Cooling Concepts & Applications
- Thermo-Mechanical Reliability
Below you can see a detailed list of topics.
The technical programme will include oral talks, poster presentations and invited keynote talks given by renowned speakers. We will again offer a short course on the day before the workshop.
Venue
University of Graz
Universitätsplatz 3
8010 Graz
Austria
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AREAS OF INTEREST
include, but are not limited to, the following topics:
Thermal Phenomena in Simulation & Experiment:
- Thermal management of electronic components and systems
- Thermal phenomena in semiconductor chips
- Classical and modern thermometry and thermography
- Thermal interface materials and their characterisation
- Thermal modelling and investigation of packages
- Nano-scale heat transfer
- Multi-physics simulation and field coupling
- Electro-thermal modelling and simulation
- CFD modelling and benchmarking
- Advanced thermal materials and technologies
- Numerical methods for multi-scale heat transfer
- Advanced mathematics and statistical concepts
Electronics Cooling Concepts & Applications:
- Power electronics cooling technologies
- Data centre and AI factory thermal management
- Cooling concepts: air, liquid, 2-phase, etc.
- HPC & chiplet cooling
- (Data-centre executable) digital twins & AI-methods
- High temperature electronics
- Solid state lighting & LED packages
- Thermo-electric and sub-ambient cooling
- Novel and advanced thermal technologies
- Heat pipe and vapor chambers
- 3D heterogeneous integration and cooling
- Ultra low form factor air cooling
- Novel manufacturing methods
- Cooling for IoT, CPS, mobile, edge computing
- Thermal buffering for computational sprinting
- Thermal management for quantum technologies & cryo-applications
- Battery thermal management
Thermo-Mechanical Reliability
- Thermo-mechanical reliability
- Prognostics and health monitoring
- Lifetime modelling and prediction
- Damage and fracture mechanics
- Failure analysis and inline inspection
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