International Workshop on Thermal Investigations of ICs and Systems

THERMINIC 2026 in Berlin

The 32nd International Workshop on Thermal Investigation of ICs and Systems took place in Berlin from September 16 to 18, 2026, bringing together the international thermal management community for three days dedicated to current research and developments in the field. Almost 160 participants from 29 countries gathered at the NYX Hotel Berlin-Koepenick, making THERMINIC 2026 the largest edition of the workshop so far.

Participants came from both academia and industry in almost equal numbers, with 53% representing universities and research institutions and 47% coming from industry. This year, 14 companies also took part as exhibitors and supporters.

This year’s awards recognized three outstanding contributions: Johann Renner and his co-authors received the Best Paper Award for “CuBrick: A Novel Vertical Dielectric Immersion Cooling Approach for Power Semiconductors”. The Best Poster Award went to Byongjin Ma and his co-authors for “Non-destructive Defect Analysis of Through-glass Vias Using Transient Thermal Response”. Maham Ayaz received the Best Young Researcher’s Contribution Award for her paper “Two-dimensional Cryogenic Micro-raman Stress Mapping in Silicon Around Through-silicon Vias and SLID Bond Interface”. Congratulations to all award winners!

The organizers would like to thank all committee members, keynote speakers, session chairs, short course instructors, presenters, exhibitors and supporters for their contributions to THERMINIC 2026.

We look forward to welcoming the THERMINIC community again at THERMINIC 2027 in Graz, Austria.

Photos © Andreas Lemke

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