Short Course

The validity of conclusions drawn from experimental research depends not only on a brilliant theoretical framework and meticulous experimentation, but also on reliable measurement set ups and correct application of the relevant statistics. In short – how good is the evidence that your input, your treatment, your design makes a difference? And if there is a difference –how large is it?

This short course aims to clarify the statistical background of when you can confidently state that there is a difference, and that it is linked to certain change in a parameter.

The short course will cover the following topics:

1. How good is my measurement? – Find out your Systematic error (Bias), Find out your Random error (Noise)
2. Is it the equipment or the measurement protocol? Repeatability and Reproducibility, and how to make a Standard Operating Procedure
3. When are two samples different? – 2 sample T test, 2 sample p test
4. When are 3 or more samples different? – ANOVA, Chi-square
5. What errors can we make when comparing 2 samples? Power (True Positive), Confidence (True Negative), False Negative, False Positive
6. How many repeats to take? Power and samplesize
7. How to fit a function: Regression
8. Setting up a Design Of Experiments (DOE)

Examples are shown mainly using a commercially available spreadsheet (Excel).

The short course is 9.00 – 17.30 on September 15^th. 2 coffee breaks and a course book are included in the price. Lunch is not included. A limited number of student places is available at student discount.

Thermal management has emerged as a critical bottleneck for electrical performance and long-term reliability in 2.5D/3D integrated systems and heterogeneously integrated architectures. Addressing this challenge requires innovative materials and approaches to enhance heat-spreading efficiency and thermal integrity.

This course will begin by exploring the potential of synthetic diamond heat spreaders, whose unmatched thermal and mechanical properties make them a game-changer for advanced system-in-package (SiP) technologies. Participants will gain insights into how diamond can be integrated into SiP architectures, combined with microfluidics for synergistic cooling, and deposited directly using emerging low-temperature techniques. The course will also address key technical challenges and provide practical guidelines for successful implementation, enabling attendees to assess whether and how diamond can be leveraged in their specific applications.

A significant focus will be on thermal interface materials (TIMs), which play a pivotal role in device packaging. As power dissipation continues to limit the performance of modern electronics—from Si integrated circuits to high-power GaN devices—current TIMs, often relying on metals with thermal conductivities below 300 W/mK (and typically under 50 W/mK), are becoming a major bottleneck. The course will discuss the limitations of existing TIMs and propose innovative pathways for improvement, including the integration of high-thermal-conductivity materials like graphene and carbon nanotubes. While these materials offer theoretical in-plane thermal conductivities up to 5,000 W/mK, their practical implementation in composites has faced challenges, such as poor interfacial thermal conductivity. The course will highlight the potential of continuous graphite integration with metals via CVD, which could overcome these limitations and unlock new opportunities for high-performance TIMs.

By the end of the course, participants will have a comprehensive understanding of diamond’s role in thermal management, the current state and future of TIMs, and actionable strategies to advance thermal solutions in their own work.

Who should attend?

This PDC is ideal for packaging engineers, thermal designers, materials scientists, and students seeking to deepen their understanding of TIMs and diamond-based solutions for next-gen power components and advanced package designs.