Proceedings
For the submitted papers, we will use an IEEE plagiarism-checking tool. All accepted contributions that pass the plagiarism check will be published in the conference proceedings and archived in IEEE Xplore (provided they comply with specifications). The papers can be searched through IEEE, Google scholar and other search engines.
Newsletter
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Presentation Guidelines for Poster Presenters
In the Poster Session each presenter will present his or her findings with one slide in two minutes.
Kindly use this template for the presentation and upload your slide in ConfTool by 7:00pm on the evening before your poster session. This will allow us to combine all posters into one Powerpoint presentation before the session.
The poster viewing will take place in the coffee break after the poster session.
During the Interactive Poster Viewing, we kindly ask all poster authors to remain close to their posters so that participants can approach them with questions and engage in discussion.
We recommend using the provided poster template, although its use is not mandatory. When preparing your poster, please ensure that the following guidelines are followed:
- Format: A0 (84.1 × 118.9 cm, portrait orientation)
- Font size: no smaller than 18 pt
- Use bullet points where possible and avoid lengthy blocks of text
- Include images and diagrams in high resolution
If you would like your poster to be printed by the conference office and delivered directly to the conference venue at cost price, please book the optional printing service via ConfTool and upload your poster by September 2, 12:00 p.m.
To upload your poster:
- Log into ConfTool.
- Click on “Your Submission”.
- Select “Final Upload”.
- Upload your poster under “3rd file” at the bottom of the page (accepted file format is pdf).
If you prefer to bring your own A0 poster to the conference, assistance with mounting it will be available on site.
Please note that all posters must be collected by Friday afternoon after the workshop. Any posters not collected cannot be stored or returned.
Presentation Guidelines for Oral Presenters
Before Your Presentation
Please be in the presentation room at least 10 minutes before the start of your session and introduce yourself to the Session Chair.
Presentation Duration
Each presentation is allocated 20 minutes in total. Please plan your talk so that 4–5 minutes remain for questions and discussion at the end of your presentation.
Presentation Format
There is no presentation template. However, please prepare your slides in 16:9 format for the best display on the conference projection system.
Presentation Upload
To ensure a smooth transition between presentations, all speakers are requested to upload their presentation slides via ConfTool by 7:00 p.m. on the evening before their presentation.
To upload your presentation:
- Log into ConfTool.
- Click on “Your Submission”.
- Select “Final Upload”.
- Upload your presentation under “2nd file” at the bottom of the page (accepted file formats are pdf, pptx and ppt).
Conference Topics:
Thermal Phenomena in Simulation & Experiment:
- Thermal management of electronic components and systems
- Thermal phenomena in semiconductor chips
- Classical and modern thermometry and thermography
- Thermal interface materials and their characterisation
- Thermal modelling and investigation of packages
- Nano-scale heat transfer
- Multi-physics simulation and field coupling
- Electro-thermal modelling and simulation
- CFD modelling and benchmarking
- Advanced thermal materials and technologies
- Numerical methods for multi-scale heat transfer
- Advanced mathematics and statistical concepts
Electronics Cooling Concepts & Applications:
- Power electronics cooling technologies
- Data centre and AI factory thermal management
- Cooling concepts: air, liquid, 2-phase, etc.
- HPC & chiplet cooling
- (Data-centre executable) digital twins & AI-methods
- High temperature electronics
- Solid state lighting & LED packages
- Thermo-electric and sub-ambient cooling
- Novel and advanced thermal technologies
- Heat pipe and vapor chambers
- 3D heterogeneous integration and cooling
- Ultra low form factor air cooling
- Novel manufacturing methods
- Cooling for IoT, CPS, mobile, edge computing
- Thermal buffering for computational sprinting
- Thermal management for quantum technologies & cryo-applications
- Battery thermal management
Thermo-Mechanical Reliability
- Thermo-mechanical reliability
- Prognostics and health monitoring
- Lifetime modelling and prediction
- Damage and fracture mechanics
- Failure analysis and inline inspection
- Thermal and Temperature Sensors
- Acquisition and analysis of Thermal data
- Thermal Simulation
- Temperature Mapping
- Electro-thermal Simulation
- Novel and Advanced Cooling Techniques
- Thermal Modelling & Investigation of Packages
- Thermal Performance of Interconnects
- Reliability Issues
- Heat Transfer Enhancement
- High Temperature Electronics
- Validation of Thermal Software
- Heat Transfer Education
- Coupled (Thermo-mechanical, Thermo-optical, etc.) Effects
- Flow Visualisation Techniques
- Turbulence Modelling in Complex Geometrics
- Thermal Stress: Theory and Experiment
- Defect and failure modelling
- Thermal Stress Failures: Prediction and Prevention
- Reliability evolution and prediction
- Multiphysics simulation
- Nanotechnology Applications
- Nanoengineering issues
- Noise control
- Education
- 3DIC, power electronics
- Measurement of Thermal Properties