Therminic 2026 – Submit your abstract!
The 32nd International Workshop on Thermal Investigations of ICs and Systems seeks original, noncommercial papers describing research and innovations related to thermal and reliability issues in electronic components and systems. Authors are invited to submit an abstract describing recent work. Abstracts must detail the objectives of the work presented and demonstrate new results.
Download Call for Papers
Conference Topics:
Thermal Phenomena in Simulation & Experiment:
- Thermal management of electronic components and systems
- Classical and modern thermometry and thermography
- Thermal interface materials and their characterisation
- Thermal modelling and investigation of packages
- Nano-scale heat transfer
- Multi-physics simulation and field coupling
- Electro-thermal modelling and simulation
- CFD modelling and benchmarking
- Advanced thermal materials and technologies
- Numerical methods for multi-scale heat transfer
- Advanced mathematics and statistical concepts / AI methods for digital twins
Electronics Cooling Concepts & Applications:
- Cooling concepts: air, liquid, 2-phase, etc.
- Power electronics cooling technologies
- HPC & Chiplet cooling
- Power electronics & HPC cooling
- High temperature electronics
- Solid state lighting & LED packages
- Thermo-electric and sub-ambient cooling
- Novel and advanced thermal technologies
- Heat pipe and vapor chambers
- 3D heterogeneous integration and cooling
- Ultra low form factor air cooling
- Novel manufacturing methods
- Cooling for IoT, CPS, mobile, edge computing
- Thermal buffering for computational sprinting
- Thermal management for quantum technologies & cryo-applications
- Battery thermal management
Thermo-Mechanical Reliability
- Thermo-mechanical reliability
- Prognostics and health monitoring
- Lifetime modelling and prediction
- Damage and fracture mechanics
- Failure analysis and inline inspection
- Thermal and Temperature Sensors
- Acquisition and analysis of Thermal data
- Thermal Simulation
- Temperature Mapping
- Electro-thermal Simulation
- Novel and Advanced Cooling Techniques
- Thermal Modelling & Investigation of Packages
- Thermal Performance of Interconnects
- Reliability Issues
- Heat Transfer Enhancement
- High Temperature Electronics
- Validation of Thermal Software
- Heat Transfer Education
- Coupled (Thermo-mechanical, Thermo-optical, etc.) Effects
- Flow Visualisation Techniques
- Turbulence Modelling in Complex Geometrics
- Thermal Stress: Theory and Experiment
- Defect and failure modelling
- Thermal Stress Failures: Prediction and Prevention
- Reliability evolution and prediction
- Multiphysics simulation
- Nanotechnology Applications
- Nanoengineering issues
- Noise control
- Education
- 3DIC, power electronics
- Measurement of Thermal Properties
Abstract Submission
Please use the provided template for your abstract. The abstract should not exceed two pages and should be uploaded as a PDF file. The online system for abstract submission will open in December 2025.
Download Template
Word – Template: Download here (.docx/ 78 KB)
Important Dates
Deadline abstract submission: April 1, 2026
Notification of acceptance: June 8, 2026
Submission of paper for workshop proceedings: August 3, 2026
Proceedings
Accepted contributions will be published in the conference proceedings and archived in IEEE Xplore (provided they comply with specifications). The papers can be searched through IEEE, Google scholar and other search engines.
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