Therminic 2026 – Submit your Full Paper!

All authors have been informed about the acceptance of their abstracts. The submission of a full paper is required for all presenters, both oral and poster. The minimum lenght is 4 full pages, maximum length is 10 pages. The papers will be distributed in time for the conference.

Full paper submission opens: June 22, 2026

Full paper submission deadline: August 3, 2026

Paper Submission

To write your paper please use the standard IEEE paper template; it can be downloaded below both in docx- and in Latex-format Please note that your full paper must go through the IEEE PDF eXpress Checker before you can submit it via ConfTool. The conference ID for the IEEE PDF eXpress Checker is 70452X

Downloads

Word – Template:
Download here (.docx/30 KB)

Latex – Template:
Download here (.zip/759 KB)

LaTeX Template Instructions:
Download here (.pdf,63 KB)

Proceedings

For the submitted papers, we will use an IEEE plagiarism-checking tool. All accepted contributions that pass the plagiarism check will be published in the conference proceedings and archived in IEEE Xplore (provided they comply with specifications). The papers can be searched through IEEE, Google scholar and other search engines.

Presentation Guidelines for Poster Presenters

During the Interactive Poster Session, we kindly ask all poster authors to remain close to their posters so that participants can approach them with questions and engage in discussion. There is no need to prepare a formal presentation; instead, we encourage you to take this opportunity to interact with fellow conference participants and discuss your research.

We recommend using the provided poster template, although its use is not mandatory. When preparing your poster, please ensure that the following guidelines are followed:

  • Format: A0 (84.1 × 118.9 cm, portrait orientation)
  • Font size: no smaller than 18 pt
  • Use bullet points where possible and avoid lengthy blocks of text
  • Include images and diagrams in high resolution

Further information regarding poster printing will be provided in due course. Assistance with mounting posters will be available on site.

Please note that all posters must be collected by Friday afternoon after the workshop. Any posters not collected cannot be stored or returned.

Important Dates

Full paper submission deadline: August 3, 2026

Newsletter

Don´t miss important dates, deadlines and announcements with the Therminic Newsletter.

Conference Topics:

Thermal Phenomena in Simulation & Experiment:

  • Thermal management of electronic components and systems
  • Thermal phenomena in semiconductor chips
  • Classical and modern thermometry and thermography
  • Thermal interface materials and their characterisation
  • Thermal modelling and investigation of packages
  • Nano-scale heat transfer
  • Multi-physics simulation and field coupling
  • Electro-thermal modelling and simulation
  • CFD modelling and benchmarking
  • Advanced thermal materials and technologies
  • Numerical methods for multi-scale heat transfer
  • Advanced mathematics and statistical concepts

Electronics Cooling Concepts & Applications:

  • Power electronics cooling technologies
  • Data centre and AI factory thermal management
  • Cooling concepts: air, liquid, 2-phase, etc.
  • HPC & chiplet cooling
  • (Data-centre executable) digital twins & AI-methods
  • High temperature electronics
  • Solid state lighting & LED packages
  • Thermo-electric and sub-ambient cooling
  • Novel and advanced thermal technologies
  • Heat pipe and vapor chambers
  • 3D heterogeneous integration and cooling
  • Ultra low form factor air cooling
  • Novel manufacturing methods
  • Cooling for IoT, CPS, mobile, edge computing
  • Thermal buffering for computational sprinting
  • Thermal management for quantum technologies & cryo-applications
  • Battery thermal management

Thermo-Mechanical Reliability

  • Thermo-mechanical reliability
  • Prognostics and health monitoring
  • Lifetime modelling and prediction
  • Damage and fracture mechanics
  • Failure analysis and inline inspection
  • Thermal and Temperature Sensors
  • Acquisition and analysis of Thermal data
  • Thermal Simulation
  • Temperature Mapping
  • Electro-thermal Simulation
  • Novel and Advanced Cooling Techniques
  • Thermal Modelling & Investigation of Packages
  • Thermal Performance of Interconnects
  • Reliability Issues
  • Heat Transfer Enhancement
  • High Temperature Electronics
  • Validation of Thermal Software
  • Heat Transfer Education
  • Coupled (Thermo-mechanical, Thermo-optical, etc.) Effects
  • Flow Visualisation Techniques
  • Turbulence Modelling in Complex Geometrics
  • Thermal Stress: Theory and Experiment
  • Defect and failure modelling
  • Thermal Stress Failures: Prediction and Prevention
  • Reliability evolution and prediction
  • Multiphysics simulation
  • Nanotechnology Applications
  • Nanoengineering issues
  • Noise control
  • Education
  • 3DIC, power electronics
  • Measurement of Thermal Properties